Part 1 of this course applies basic physical principles to develop an understanding of the key issues of high-speed design, to ensure a successful design for signal integrity. These range from controlling reflections and crosstalk to the design of the power distribution system and the PCB layer structure. The course is liberally illustrated with examples and "what if" scenarios showing by simulation the effects of varying different parameters, enabling participants to develop an understanding of their relative importance and magnitude. Helpful guidelines on assessing and implementing best practice are included. Practical issues are considered throughout. The basic techniques developed can be applied immediately to improve PCB design, without the use of EDA signal integrity tools, but the course also provides a much-needed foundation for understanding how to benefit from the use of such tools.
Part 1 course content

Part 2 builds seamlessly on the principles and practice established in Part 1, extending them to develop techniques for design and test at frequencies above 1 GHz for Gb/s serial transmission and for controlling the generation and propagation of EMI at the PCB level. Key topics cover signal quality, material effects and EMC from components to backplanes.
Part 2 course content

Note: this is an integrated course where the concepts and methods developed in Part 1 are applied directly to the topics in Part 2. Delegates to Part 2 of the course are therefore strongly advised to attend Part 1 first.

Design engineers seeking in-depth knowledge of high-speed PCB design, signal integrity issues, high frequency effects and EMC. As the course is built up from basic electrical principles it is suitable for engineers from many areas of application, and also for new graduates.

PCB designers working on digital or mixed signal boards with design rules governing track impedance control, line terminations, routing to minimise noise coupling etc. will also benefit from this course.

Part 1 (3 days) Essential High-speed PCB Design for Signal Integrity Course content Signal waveforms, frequency components and risetime. Bandwidths of analog and digital signals. How capacitance and loop inductance on a PCB determine signal behaviour. Current paths on a PCB. Impedance control of the power distribution system. Controlling induced noise - decoupling networks, PCB planes, bandwidth requirements. Optimising power delivery. Track impedance Impedance control, reflections, and line terminations. Effects of PCB structure, materials, geometry and fabrication. Track impedance testing. Coupled lines. Odd and even modes - differential and common mode currents. Differential transmission, routing and termination. Unwanted coupling - crosstalk. Near end and far end crosstalk, effects of coupled length, multiple lines. ICs for high-speed design I/O characteristics, I/V curves, transition timing. Behavioural device models, IBIS standards. PCB routing topologies. Branching, non-branching, constraints. Discontinuity effects - connectors, vias, stubs etc. Equalisation, multiple capacitance loading, clock distriubution. Top of page

Part 2 (2 days) High-speed PCB Design for Gigabit Data Rates and EMI Control Course content What is "high-speed" (Part II)? - trends in design and technology PCB implications for high-speed serial buses. High frequency measurement and test - components and signal paths. Measuring in the time domain (scope, TDR/TDT) and frequency domain (spectrum analyser, VNA). Probe characteristics and limitations. S-parameters - physical meaning and measurement. Gb/s transmission on PCBs Application of transmission engineering methods. Measuring signal quality (BER, eye diagrams, jitter, ISI). Signal degradation due to PCB track effects. Technologies (eg, LVDS, PCI Express). PCB requirements to meet system performance. PCB material for high-speed design Frequency-dependent PCB transmission lines - waveform degradation due to conductor and dielectric loss. PCB material selection - frequency behaviour, manufacturing and cost tradeoffs, and criteria for acceptable signal performance. EMC control EMI mechanisms and coupling paths - what factors can we control? Wave propagation, near and far field impedance. RF field generation on a PCB. Differential to common mode conversion and radiation. Controlling EMI generation on PCBs Image planes, stackup, return currents. Grounding schemes, common mode current loops, common impedance coupling, partitioning, split planes. EMI from components to systems IC package parasitics, ground bounce, mutual capacitance. Minimising component level effects. Filtering, isolation and bridging on PCBs. Interconnections, cables, backplanes, signal routing. Top of page