Part 1 of this course applies basic physical principles to understanding
of the key issues of high-speed design, to ensure a successful design
for signal integrity. These range from controlling reflections and
crosstalk to the design of the power distribution system and the PCB layer structure.
The course is liberally illustrated with examples and "what if" scenarios showing
by simulation the effects of varying different parameters, enabling participants
to develop an understanding of their relative importance and magnitude. Helpful
guidelines on assessing and implementing best practice are included. Practical
issues are considered throughout. The basic techniques developed can be applied
immediately to improve PCB design, without the use of EDA signal integrity tools,
but the course also provides a much-needed foundation for understanding how to benefit
from the use of such tools.
Part 1 course content
Part 2 builds seamlessly on the principles and practice established in Part 1, extending
them to develop techniques for design and test at frequencies above 1 GHz for Gb/s serial
transmission and for controlling the generation and propagation of EMI at the PCB level.
Key topics cover signal quality, material effects and EMC from components to backplanes.
Part 2 course content
Note: this is an integrated course where the concepts and methods developed in Part 1
are applied directly to the topics in Part 2. Delegates to Part 2 of the course are
therefore strongly advised to attend Part 1 first.
Who Should Attend
Design engineers seeking in-depth knowledge of high-speed PCB design, signal integrity
issues, high frequency effects and EMC. As the course is built up from basic electrical
principles it is suitable for engineers from many areas of application, and also for new
graduates.
PCB designers working on digital or mixed signal boards with design rules governing track
impedance control, line terminations, routing to minimise noise coupling etc. will also
benefit from this course.
For a detailed course description click here.